IGSINK delivers high-performance CPU heat sinks engineered for optimal thermal management. Our aluminum and copper cooling solutions ensure superior heat dissipation for processors across all applications.
Comprehensive thermal management solutions for modern processors
CPU heat sinks work through conductive heat transfer, absorbing thermal energy from processors and dissipating it to surrounding air through increased surface area and thermal conductivity.
Our heat sinks are designed with optimized thermal resistance values, typically ranging from 0.1 to 10 °C/W depending on application requirements and power dissipation needs.
Pin fin and plate fin designs maximize surface area for heat transfer, with fin density and geometry calculated for optimal air flow and heat dissipation performance.
Most common manufacturing method for CPU heat sinks. Aluminum billets are heated to 520-540°C and extruded through custom dies to create complex fin geometries. Ideal for high-volume production with excellent cost-effectiveness.
Precision manufacturing process offering highest design flexibility. Heat sinks are machined from solid aluminum or copper blocks, enabling complex geometries and tight tolerances for high-performance applications.
High-pressure casting process similar to injection molding. Molten aluminum is forced into precision molds under pressure, enabling thin walls and complex internal structures for CPU cooling applications.
Advanced manufacturing where fins are cut from solid copper or aluminum blocks using precision skiving tools. Creates high fin density with excellent thermal conductivity for high-performance CPU cooling.
Proper sizing requires calculating total thermal resistance from junction to ambient, considering component thermal resistance, thermal interface material, and heat sink performance.
Fin spacing and orientation must be optimized for natural or forced convection. Proper air flow channels ensure maximum heat transfer coefficient and cooling efficiency.
Fin density, height, and thickness are engineered to maximize surface area while maintaining structural integrity and manufacturability constraints.
Maximum power dissipation: P = (T_junction – T_ambient) / R_thermal
Clean CPU surface and heat sink base. Remove any protective films or debris. Ensure mounting hardware is compatible with motherboard socket.
Apply thin, even layer of thermal compound or install thermal pad. Ensure complete coverage without excess material that could impede heat transfer.
Align heat sink with CPU socket and mounting holes. Apply even pressure while securing mounting screws or clips to ensure proper contact.
Connect fan power cable to motherboard header. Verify secure mounting and check CPU temperatures during initial system operation.
1150, 1151, 1155, 1156, 1200, 1700
Ryzen compatible sockets
LGA 2011, 3647, SP3
Specialized applications
Advanced facilities and quality systems for CPU heat sink production
State-of-the-art extrusion lines, CNC machining centers, and precision tooling for high-volume CPU heat sink production with consistent quality.
Comprehensive quality management system ensuring consistent product quality, process control, and continuous improvement in CPU cooling solutions.
In-house thermal conductivity testing, dimensional verification, and performance validation ensuring every CPU heat sink meets specifications.
Efficient logistics and supply chain management ensuring timely delivery of CPU heat sink solutions worldwide with comprehensive packaging.
High-performance CPU heat sinks for gaming rigs, workstations, and standard desktop computers. Optimized for Intel and AMD processors with TDP ratings up to 280W.
Specialized CPU cooling solutions for data centers and server environments. 1U, 2U, and 4U form factors with high-efficiency thermal management for continuous operation.
Compact CPU heat sink solutions for embedded computing, industrial controllers, and specialized electronic equipment requiring efficient thermal management in space-constrained environments.
Ready to optimize your CPU thermal management? Get in touch with our engineering team for custom heat sink design and manufacturing solutions.