Professional CPU Heat Sink Aluminum Cooler

Professional CPU Heat Sink Solutions

IGSINK delivers high-performance CPU heat sinks engineered for optimal thermal management. Our aluminum and copper cooling solutions ensure superior heat dissipation for processors across all applications.

237 W/mK
Aluminum Thermal Conductivity
15+ Years
Manufacturing Experience

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Understanding CPU Heat Sink Technology

Comprehensive thermal management solutions for modern processors

 

Heat Transfer Mechanism

CPU heat sinks work through conductive heat transfer, absorbing thermal energy from processors and dissipating it to surrounding air through increased surface area and thermal conductivity.

 

Thermal Resistance

Our heat sinks are designed with optimized thermal resistance values, typically ranging from 0.1 to 10 °C/W depending on application requirements and power dissipation needs.

 

Surface Area Optimization

Pin fin and plate fin designs maximize surface area for heat transfer, with fin density and geometry calculated for optimal air flow and heat dissipation performance.

CPU Heat Sink Manufacturing Processes

Aluminum Extrusion

Most common manufacturing method for CPU heat sinks. Aluminum billets are heated to 520-540°C and extruded through custom dies to create complex fin geometries. Ideal for high-volume production with excellent cost-effectiveness.

  •  Low production cost and fast manufacturing
  •  Suitable for complex cross-sectional profiles
  •  Excellent for 6063-T5 aluminum alloys
  •  Optimal fin thickness ratios achievable

CNC Machining

Precision manufacturing process offering highest design flexibility. Heat sinks are machined from solid aluminum or copper blocks, enabling complex geometries and tight tolerances for high-performance applications.

  •  Superior surface finish and precision
  •  Complex 3D geometries possible
  •  Ideal for prototypes and custom designs
  •  Compatible with aluminum and copper

Die Casting

High-pressure casting process similar to injection molding. Molten aluminum is forced into precision molds under pressure, enabling thin walls and complex internal structures for CPU cooling applications.

  •  Dense and thin fin designs achievable
  •  Complex internal cooling channels
  •  High-volume production capability
  •  Excellent dimensional accuracy

Skived Fin Technology

Advanced manufacturing where fins are cut from solid copper or aluminum blocks using precision skiving tools. Creates high fin density with excellent thermal conductivity for high-performance CPU cooling.

  •  Maximum fin density achievable
  •  Excellent for copper heat sinks
  •  Superior thermal performance
  •  Minimal thermal interface resistance

Material Specifications and Performance

Aluminum Heat Sinks

Thermal Conductivity:237 W/m·K
Density:2.7 g/cm³
Melting Point:660°C
Typical Alloys:6063-T5, 6061-T6

Key Advantages:

  •  Lightweight and cost-effective solution
  •  Excellent corrosion resistance
  •  Superior machinability and formability
  •  Ideal for high-volume production
  •  Suitable for most CPU cooling applications

Copper Heat Sinks

Thermal Conductivity:401 W/m·K
Density:8.96 g/cm³
Melting Point:1085°C
Typical Grades:C101, C110

Key Advantages:

  •  Superior thermal conductivity performance
  •  Excellent for high-power CPU applications
  •  Outstanding durability and longevity
  •  Preferred for overclocking scenarios
  •  Optimal for extreme thermal requirements

CPU Heat Sink Design Considerations

 

Thermal Resistance Calculation

Proper sizing requires calculating total thermal resistance from junction to ambient, considering component thermal resistance, thermal interface material, and heat sink performance.

 

Air Flow Optimization

Fin spacing and orientation must be optimized for natural or forced convection. Proper air flow channels ensure maximum heat transfer coefficient and cooling efficiency.

 

Surface Area Maximization

Fin density, height, and thickness are engineered to maximize surface area while maintaining structural integrity and manufacturability constraints.

Thermal Design Guidelines

Power Dissipation Formula

Maximum power dissipation: P = (T_junction – T_ambient) / R_thermal

  •  T_junction: Maximum operating temperature
  •  T_ambient: Environmental temperature
  •  R_thermal: Total thermal resistance

Design Optimization

  •  Minimize thermal interface thickness
  •  Optimize fin geometry for air flow
  •  Consider natural vs forced convection
  •  Account for mounting pressure distribution

CPU Heat Sink Installation Guide

1

Preparation

Clean CPU surface and heat sink base. Remove any protective films or debris. Ensure mounting hardware is compatible with motherboard socket.

2

Thermal Interface

Apply thin, even layer of thermal compound or install thermal pad. Ensure complete coverage without excess material that could impede heat transfer.

3

Mounting

Align heat sink with CPU socket and mounting holes. Apply even pressure while securing mounting screws or clips to ensure proper contact.

4

Verification

Connect fan power cable to motherboard header. Verify secure mounting and check CPU temperatures during initial system operation.

Socket Compatibility

Intel LGA

1150, 1151, 1155, 1156, 1200, 1700

AMD AM4

Ryzen compatible sockets

Server Grade

LGA 2011, 3647, SP3

Custom

Specialized applications

IGSINK Manufacturing Excellence

Advanced facilities and quality systems for CPU heat sink production

IGSINK Manufacturing Facility

World-Class Production Capabilities

 

Advanced Manufacturing

State-of-the-art extrusion lines, CNC machining centers, and precision tooling for high-volume CPU heat sink production with consistent quality.

 

ISO 9001:2015 Certified

Comprehensive quality management system ensuring consistent product quality, process control, and continuous improvement in CPU cooling solutions.

 

Material Testing Laboratory

In-house thermal conductivity testing, dimensional verification, and performance validation ensuring every CPU heat sink meets specifications.

 

Global Supply Chain

Efficient logistics and supply chain management ensuring timely delivery of CPU heat sink solutions worldwide with comprehensive packaging.

Applications and Performance

 

Desktop Computing

High-performance CPU heat sinks for gaming rigs, workstations, and standard desktop computers. Optimized for Intel and AMD processors with TDP ratings up to 280W.

  •  Gaming and enthusiast systems
  •  Content creation workstations
  •  Business desktop computers
 

Server Applications

Specialized CPU cooling solutions for data centers and server environments. 1U, 2U, and 4U form factors with high-efficiency thermal management for continuous operation.

  •  Data center servers
  •  Cloud computing infrastructure
  •  Enterprise server systems
 

Embedded Systems

Compact CPU heat sink solutions for embedded computing, industrial controllers, and specialized electronic equipment requiring efficient thermal management in space-constrained environments.

  •  Industrial automation systems
  •  Medical equipment processors
  •  Automotive computing units

Performance Specifications

0.05-15
°C/W Thermal Resistance Range
450W
Maximum Power Dissipation
-40 to +85
°C Operating Range
99.9%
Quality Assurance Rate

Contact IGSINK for Custom CPU Heat Sink Solutions

Ready to optimize your CPU thermal management? Get in touch with our engineering team for custom heat sink design and manufacturing solutions.

Contact Information

 

Dadan (No. 1), Heshan Village,
Yuanzhou Town, Boluo County,
Huizhou City, Guangdong Province, China

Our Capabilities

  •  Custom CPU heat sink design
  •  Thermal analysis and simulation
  •  Prototype development
  •  High-volume manufacturing
  •  Quality testing and validation
  •  Global shipping and support
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