Leveraging a 15,000-square-meter production facility and over a decade of thermal engineering expertise, IGS delivers customized stacked fin heat sink solutions for high-power applications. Our vertically integrated design-to-production system ensures precision thermal management with thermal resistance as low as 0.026°C/W, supporting heat loads up to 620W for servers, renewable energy systems, and advanced computing platforms.
We offer thermal simulation,thermal design,verification and tests for free
What Is a Stacked Fin Heat Sink?
A stacked fin heat sink optimizes heat dissipation by layering thin, stamped metal fins on a baseplate. Key features include:
Enhanced Surface Area: 30%+ efficiency gain via dense fin stacking.
Material Flexibility: Compatible with aluminum, copper, or hybrid substrates.
High-Power Adaptability: Integrates heat pipes (K≥8,000) and vacuum brazing for 300W+ scenarios.
Stacked Fin Heat Sink Production Capabilities
Process
Equipment
Capacity
Quality Assurance
Precision Stamping
12 presses (3 high-speed)
400K/mo
±0.05mm tolerance
Vacuum Brazing
4 reflow ovens
800K/mo
<0.01% void rate
Heat Pipe Integration
32 CNC benders
2M/mo
3D bending, 0.8mm thickness
Full-System Testing
Helium leak detectors
20K/mo
ISO/IEC 17025 certified
Stacked Fin Heat Sink Competitive Advantages
R&D Leadership:
25-member engineering team with 6 patents (e.g., pressure-tube brazing).
CFD simulation accuracy >97% for 620W validation.
Scalable Manufacturing:
72-hour prototype turnaround via 42 CNC units.
1.22M/month modular assembly capacity.
Compliance & Sustainability:
ISO 9001/14001/45000 and QC080000 certified.
ROHS/REACH-compliant materials.
Stacked Fin Heat Sink Material Options
Type
Thermal Conductivity
Applications
Aluminum 6063-T5
220 W/m·K
Low-power air cooling (<200W)
Copper-Aluminum Hybrid
380 W/m·K
Liquid cooling (300W+)
Sintered Ultra-Thin Pipe
K≥8,000
Space-constrained 1U servers
IGS combines innovation, agility, and compliance to redefine thermal solutions for next-gen technologies. Partner with us to future-proof your thermal architecture.