Bonded Fin Heat Sink

Bonded Fin Heat Sink Manufacturers & Suppliers

IGS is a leading manufacturer specializing in the design and production of electronic cooling products, offering comprehensive one-stop cooling solutions that integrate design, development, and manufacturing. With a customer-centric approach and a focus on innovation, IGS delivers high-quality Bonded Fin Heat Sink solutions, ensuring efficient thermal management for a wide range of applications.

What is a Bonded Fin Heat Sink?

A Bonded Fin Heat Sink is a high-performance cooling solution where individual fins are bonded to a base using advanced adhesive or mechanical bonding techniques, providing excellent thermal conductivity and structural stability. This design allows for greater flexibility in fin density and height, making it ideal for applications requiring efficient heat dissipation in compact or high-power environments.

Features of Bonded Fin Heat Sink

  • High Thermal Performance: The bonding process ensures low thermal resistance and efficient heat transfer from the base to the fins.
  • Customizable Design: Offers flexibility in fin spacing, height, and material, catering to specific thermal and spatial requirements.
  • Robust Construction: Strong bonding ensures durability and reliability, even under high thermal loads or mechanical stress.
  • Lightweight and Cost-Effective: Compared to other high-performance heat sinks, bonded fin designs can balance performance and cost effectively.

Applications of Bonded Fin Heat Sink

Bonded Fin Heat Sinks are widely used in various industries, including:

  • Server and Data Center Equipment: For cooling high-power CPUs and GPUs in servers, such as Intel Purley, Whitley, and Eagle Stream platforms, as well as AMD SP3/SP5 platforms.
  • Telecommunications: Used in networking hardware and base stations to manage heat in compact, high-density environments.
  • Industrial PCs and Control Systems: Applied in industrial computing and automation systems where reliable cooling is critical.
  • LED Lighting and Power Electronics: Suitable for LED lighting systems, inverters, and other power electronics requiring efficient heat dissipation.

Our Bonded Fin Heat Sink Production Capacity

Production Process Number of Equipment Monthly Capacity (PCS) Remarks
CNC Machining (Vertical) 42 units 650,000 Ensures precise fin and base machining
CNC Machining (Horizontal) 3 units 100,000 Supports large-scale component production
Assembly Lines 4 lines 1,220,000 Efficient assembly of bonded fin structures
Thermal Resistance Testing 5 units 800,000 Verifies thermal performance and reliability
Polishing Machines 3 units 200,000 Enhances surface finish for better heat transfer
Material Cutting Machines 2 units 1,000,000 Prepares raw materials with high precision

Why Choose Us?

Choosing IGS’s Bonded Fin Heat Sink services means partnering with a company that combines cutting-edge technology, robust manufacturing capabilities, and a commitment to quality. Our experienced R&D team continuously innovates to meet your specific thermal management needs, while our state-of-the-art production facilities ensure timely delivery and consistent performance. With a proven track record, including a three-year shipment total of 1,012,640 PCS for server heat sinks, and a 52% market share in server and communication products, we are your trusted partner for reliable, high-performance cooling solutions. Contact us today to discover how our Bonded Fin Heat Sinks can optimize your thermal management and drive your success!

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