Skived Heat Sink Manufacturers & Suppliers

IGS delivers precision-engineered skived fin heat sinks with self-developed processes, achieving ultra-thin fins (minimum 0.1mm), high thermal density (0.026°C/W), and customized solutions for high-power applications in servers, new energy, laser systems, and more.

Breakthrough in Process Limits: Fin thickness as low as 0.1mm, fin density increased by 40%, leading industry standards.
Proven Reliability: Validated through 20+ rigorous tests including thermal resistance testing (CPU ΔT ≤2.32°C) and salt spray testing (48H corrosion-free).
Mass Production Capacity: 50K/Month skived fin output with 42 CNC machines supporting 650K/Month precision machining.
Broad Compatibility: Customizable for Intel/AMD server platforms (e.g., Whitley, Eagle Stream) and new energy applications.
Cost-Efficiency: Integrated design-to-delivery process reduces lead time to 15 days, with costs 10%-15% lower than competitors.

Why Choose Skived Fin Heat Sinks?

High-Power Thermal Management:
- Ideal for scenarios exceeding 310W per board (e.g., dual-CPU servers at 620W). Skiving eliminates welding interfaces, reducing thermal resistance by 15%-20% versus traditional methods.
- 30%-50% larger surface area compared to stamped/aluminum-extruded fins, ensuring CPU temperatures stay below 80°C (validated in Whitley 2U server case).
Flexible Design & Lightweight:
- Supports asymmetric fin layouts and multi-channel airflow for 1U/2U server constraints.
- Aluminum/copper base options reduce weight by 60% versus liquid cooling, ideal for mobile applications (e.g., EVs, laser projectors).
Long-Term Durability:
- Monolithic structure prevents delamination, passing 1,000 thermal cycles with <1% performance degradation, lifespan 8-10 years.

Why IGS?

End-to-End Expertise:
- Evolved from aluminum extrusion (2017) to skiving dominance (2020) and liquid-cooling integration (2023), covering full-scenario thermal solutions.
- 25 R&D engineers provide simulation support (e.g., ±0.5°C accuracy in case studies) and rapid design iterations.
Quality Assurance:
- 40-member QA team ensures 99.8% yield using ROHS analyzers, 3D CMMs (±1μm precision), and ISO9001/14001/45000-certified workflows.
Industry Leadership:
- 1.01M+ server heat sinks shipped (Intel/AMD platforms); customized solutions for PV inverters (thermal resistance <0.03°C/W).

Production Capabilities & Key Equipment

Process Stage	Key Equipment	Monthly Capacity	Precision/Performance Metrics
Skiving	Skiving equipment (1 production line)	50K/Month	Fin thickness 0.1-2.0mm
CNC Machining	Vertical CNC machines (42 units)	650K/Month	Dimensional tolerance ±0.01mm
Surface Treatment	Polishing/Wire drawing (7 units)	700K/Month	Surface roughness Ra≤0.8μm
Testing	Thermal resistance testers (5 units)	800K/Month	Measurement error ±0.001°C/W
Pressure Testing	Helium leak detector (1 unit)	20K/Month	Leak rate <1×10⁻⁶ Pa·m³/s

Contact IGS’s dedicated business team (30+ experts) for optimized thermal solutions or tailored quotes. Leverage our 300+ success stories to unlock your project’s potential.

Skived Heat Sink Manufacturer Workshop Display

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